Lianqiang Intelligence | SEMICON News
Release date:
2023-07-21
Author: Lian Qiang Intelligence
As the largest semiconductor industry event of 2023, SEMICON brought together thousands of upstream and downstream companies from across the sector. As a leading provider of integrated semiconductor services, Lianqiang Intelligent showcased at this year’s show its third-generation 6–8-inch silicon carbide dicing machines, third-generation high-precision diamond-wire saws for 6–8-inch silicon carbide wafers, CNC crystal rounding and flat‑grinding machines, sapphire 6–8-inch dicing machines, and semiconductor silicon dicing machines for 8–12-inch wafers. The company received high praise from both new and existing customers, with several industry leaders announcing during the exhibition that they plan to place substantial additional orders in the near term.
As the largest semiconductor industry event of 2023, SEMICON brought together thousands of upstream and downstream companies from across the sector. As a leading provider of integrated semiconductor services, Lianqiang Intelligent showcased at this year’s show its third-generation 6–8-inch silicon carbide dicing machines, third-generation high-precision diamond-wire saws for 6–8-inch silicon carbide wafers, CNC crystal rounding and flat‑grinding machines, sapphire 6–8-inch dicing machines, and semiconductor silicon dicing machines for 8–12-inch wafers. The company received high praise from both new and existing customers, with several industry leaders announcing during the exhibition that they plan to place substantial additional orders in the near future.
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