PRODUCTS
Silicon Equipment
Silicon equipment is the foundational infrastructure of the integrated circuit industry, spanning the entire process—from silicon single-crystal growth and wafer fabrication to chip photolithography and thin-film etching—enabling mass production of silicon wafers and microelectronic devices. It is widely used in consumer electronics, computing‑power chips, and industrial control, serving as the core cornerstone of semiconductor industry development.
PRODUCTS
SiC Equipment
Silicon carbide equipment is a core component of third-generation semiconductor manufacturing, encompassing crystal growth, substrate processing, epitaxy, and chip fabrication. Tailored to the ultra‑high‑temperature and high‑hardness characteristics of SiC, it enables the production of high‑performance power wafers that are widely used in new‑energy vehicles and photovoltaic energy storage systems, thereby facilitating the efficient miniaturization of power electronic systems.
PRODUCTS
InP/GaAs Equipment
Indium phosphide and gallium arsenide equipment constitute the core tools of second-generation compound semiconductors, encompassing single-crystal growth, epitaxy, and wafer processing. Leveraging precision epitaxial techniques, these systems produce high-frequency optoelectronic epitaxial wafers, widely used in 5G/6G RF applications, high-speed optical modules, and LiDAR, thereby supporting the industrialization of optical communication and millimeter-wave devices.
PRODUCTS
Sapphire Equipment
Sapphire equipment is a core platform for optoelectronic materials, covering the entire production process—from crystal growth and slicing to grinding and polishing—yielding high‑quality sapphire substrates and optical wafers. These products are widely used in LED chips, optical windows, and cover plates for consumer electronics, thereby underpinning the development of the optoelectronics and precision optics industries.
PRODUCTS
Silicon Component Equipment
Silicon component equipment is a critical piece of ancillary machinery in semiconductor manufacturing, enabling the precision machining of high-purity silicon rings, silicon boats, silicon electrodes, and other precision parts. Leveraging high-precision cutting and surface‑treatment technologies, these products are compatible with high‑temperature wafer processing steps and are widely employed in chip diffusion, etching, and thin‑film deposition processes, thereby ensuring the stable operation of semiconductor production lines.
Contact number: +86-0510-68106702
Sales email: lqsale@linton.group
Address: No. 15, Jinghong Road, Xibei Town, Xishan District, Wuxi City
Dalian Factory: No. 30, Huantai West Street, Yingchengzi Industrial Park, Ganjingzi District, Dalian City