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Lianqiang Intelligence | CIOE Optoelectronics Exhibition News
As a large-scale, highly influential comprehensive exhibition for the optoelectronics industry, the 24th China International Optoelectronics Expo was held from September 6 to 8, 2023, at the Shenzhen International Convention and Exhibition Center, bringing together over a thousand upstream and downstream companies from the semiconductor sector. As a leading provider of semiconductor integration services, Lianqiang Intelligent showcased at this year’s event equipment including third-generation silicon carbide 6- to 8-inch slicing machines, third-generation high-precision diamond-wire dicing machines for 6- to 8-inch wafers, CNC crystal rounding and flat‑grinding machines, sapphire 6- to 8-inch slicing machines, and semiconductor silicon 8- to 12-inch slicing machines, earning high praise from both new and existing customers.
2023-09-08
Wuxi Lianqiang Intelligent Equipment Makes Its Debut at the Shenzhen Optics Fair
On Wednesday, September 11, 2024, the Shenzhen Optics Expo buzzed with excitement, and Wuxi Lianqiang Intelligent Equipment Co., Ltd. made a striking appearance as a leading manufacturer of semiconductor processing equipment.
2024-09-13
Lianqiang Intelligence | SEMICON News
As the largest semiconductor industry event of 2023, SEMICON brought together thousands of upstream and downstream companies from across the sector. As a leading provider of integrated semiconductor services, Lianqiang Intelligent showcased at this year’s show its third-generation 6–8-inch silicon carbide dicing machines, third-generation high-precision diamond-wire saws for 6–8-inch silicon carbide wafers, CNC crystal rounding and flat‑grinding machines, sapphire 6–8-inch dicing machines, and semiconductor silicon dicing machines for 8–12-inch wafers. The company received high praise from both new and existing customers, with several industry leaders announcing during the exhibition that they plan to place substantial additional orders in the near term.
2023-07-21