Brand-new ultra-high-line-speed diamond wire slicing machine


Release date:

2023-07-20

Author: Lian Qiang Intelligence

Wuxi Lianqiang Intelligent Equipment Co., Ltd. specializes in the research, development, and manufacturing of processing equipment for semiconductors such as silicon, germanium, gallium arsenide, and silicon carbide, as well as for sapphire crystals, ceramics, graphite, optical materials, and quartz. The company provides customers with customized professional machinery—including cutting, squaring, tumbling, slicing, and polishing—and comprehensive automated turnkey solutions.

Wuxi Lianqiang Intelligent Equipment Co., Ltd. specializes in the research, development, and manufacturing of processing equipment for semiconductors such as silicon, germanium, gallium arsenide, and silicon carbide, as well as for sapphire crystals and materials including ceramics, graphite, optics, and quartz. The company provides customers with customized professional machinery for operations like cutting, squaring, tumbling, slicing, and polishing, along with comprehensive automated turnkey solutions.

 

 

Technical Indicators:

Processing specifications: 155mm x 155mm

Processing length: ≤700 mm

Maximum linear speed: 50 m/s

Cutting method: Material swings and cuts downward.

Maximum swing angle: ±12°

 

Equipment Advantages:

1. The machine bed, spindle housing support, vertical feed column, and feed slide are all integrally cast, making them well-suited for high-precision, high‑speed machining.

2. The fixed‑support spindle motor features a hollow shaft with internal cooling, ensuring stable operating temperatures over extended periods and maintaining machining accuracy.

3. The fixture employs a swing‑type mechanism to ensure that the workpiece undergoes oscillatory cutting during machining, resulting in uniform cutting forces.

4. Equipped with a Siemens motion control system and original‑equipment manufacturer motors, the equipment boasts an extremely low wire‑breakage rate.

5. Surface quality—indicators such as TTV, line marks, edge chipping, and wire breakage—are all well controlled.