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2024 China International Conference on the Development of New Semiconductor Materials (Taiyuan)

2024 China International Conference on the Development of New Semiconductor Materials (Taiyuan)

From May 22 to 25, the 2024 China International Conference on the Development of New Semiconductor Materials (Taiyuan) was successfully held in the picturesque city of Taiyuan, renowned as the “New Capital of Bingzhou” and the “Dragon City of Jinyang.”

2024-06-06

Lianqiang Intelligence has successfully obtained the “High-Tech Enterprise” designation for 2023.

Lianqiang Intelligence has successfully obtained the “High-Tech Enterprise” designation for 2023.

Lianqiang Intelligent is a wholly owned subsidiary of Liancheng CNC, boasting strong technical expertise in mechanical design and manufacturing as well as electrical automation. It maintains robust collaborations with semiconductor customers, renowned universities, leading experts, and research institutions both domestically and internationally.

2023-11-10

Brand-new ultra-high-line-speed diamond wire slicing machine

Brand-new ultra-high-line-speed diamond wire slicing machine

Wuxi Lianqiang Intelligent Equipment Co., Ltd. specializes in the research, development, and manufacturing of processing equipment for semiconductors such as silicon, germanium, gallium arsenide, and silicon carbide, as well as for sapphire crystals, ceramics, graphite, optical materials, and quartz. The company provides customers with customized professional machinery—including cutting, squaring, tumbling, slicing, and polishing—and comprehensive automated turnkey solutions.

2023-07-20

Silicon carbide dicing saw

Silicon carbide dicing saw

As the largest semiconductor industry event of 2023, SEMICON brought together thousands of upstream and downstream companies from across the sector. As a leading provider of integrated semiconductor services, Lianqiang Intelligent showcased at this year’s show its third-generation 6–8-inch silicon carbide dicing machines, third-generation high-precision diamond-wire saws for 6–8-inch silicon carbide wafers, CNC crystal rounding and flat‑grinding machines, sapphire 6–8-inch dicing machines, and semiconductor silicon dicing machines for 8–12-inch wafers. The company received high praise from both new and existing customers, with several industry leaders announcing during the exhibition that they plan to place substantial additional orders in the near term.

2023-07-21

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