News
2024 China International Conference on the Development of New Semiconductor Materials (Taiyuan)

2024 China International Conference on the Development of New Semiconductor Materials (Taiyuan)

From May 22 to 25, the 2024 China International Conference on the Development of New Semiconductor Materials (Taiyuan) was successfully held in the picturesque city of Taiyuan, renowned as the “New Capital of Bingzhou” and the “Dragon City of Jinyang.”

2024-06-06

Lianqiang Intelligence has successfully obtained the “High-Tech Enterprise” designation for 2023.

Lianqiang Intelligence has successfully obtained the “High-Tech Enterprise” designation for 2023.

Lianqiang Intelligent is a wholly owned subsidiary of Liancheng CNC, boasting strong technical expertise in mechanical design and manufacturing as well as electrical automation. It maintains robust collaborations with semiconductor customers, renowned universities, leading experts, and research institutions both domestically and internationally.

2023-11-10

Brand-new ultra-high-line-speed diamond wire slicing machine

Brand-new ultra-high-line-speed diamond wire slicing machine

Wuxi Lianqiang Intelligent Equipment Co., Ltd. specializes in the research, development, and manufacturing of processing equipment for semiconductors such as silicon, germanium, gallium arsenide, and silicon carbide, as well as for sapphire crystals, ceramics, graphite, optical materials, and quartz. The company provides customers with customized professional machinery—including cutting, squaring, tumbling, slicing, and polishing—and comprehensive automated turnkey solutions.

2023-07-20

Silicon carbide dicing saw

Silicon carbide dicing saw

As the largest semiconductor industry event of 2023, SEMICON brought together thousands of upstream and downstream companies from across the sector. As a leading provider of integrated semiconductor services, Lianqiang Intelligent showcased at this year’s show its third-generation 6–8-inch silicon carbide dicing machines, third-generation high-precision diamond-wire saws for 6–8-inch silicon carbide wafers, CNC crystal rounding and flat‑grinding machines, sapphire 6–8-inch dicing machines, and semiconductor silicon dicing machines for 8–12-inch wafers. The company received high praise from both new and existing customers, with several industry leaders announcing during the exhibition that they plan to place substantial additional orders in the near term.

2023-07-21

Lianqiang Intelligence | CIOE Optoelectronics Exhibition News

Lianqiang Intelligence | CIOE Optoelectronics Exhibition News

As a large-scale, highly influential comprehensive exhibition for the optoelectronics industry, the 24th China International Optoelectronics Expo was held from September 6 to 8, 2023, at the Shenzhen International Convention and Exhibition Center, bringing together over a thousand upstream and downstream companies from the semiconductor sector. As a leading provider of semiconductor integration services, Lianqiang Intelligent showcased at this year’s event equipment including third-generation silicon carbide 6- to 8-inch slicing machines, third-generation high-precision diamond-wire dicing machines for 6- to 8-inch wafers, CNC crystal rounding and flat‑grinding machines, sapphire 6- to 8-inch slicing machines, and semiconductor silicon 8- to 12-inch slicing machines, earning high praise from both new and existing customers.

2023-09-08

Wuxi Lianqiang Intelligent Equipment Makes Its Debut at the Shenzhen Optics Fair

Wuxi Lianqiang Intelligent Equipment Makes Its Debut at the Shenzhen Optics Fair

On Wednesday, September 11, 2024, the Shenzhen Optics Expo buzzed with excitement, and Wuxi Lianqiang Intelligent Equipment Co., Ltd. made a striking appearance as a leading manufacturer of semiconductor processing equipment.

2024-09-13

< 123 >