Diamond Wire Cutting Machine
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Keywords：Diamond Wire Cutting Machine
Technical Specifications
Main Technical Index
| Size of the workpiece | φ100-φ350mm/L:100mm | 6–8 slicing TTV | ≤30μm |
| Average cutting speed | 0.3 mm/min | Tank volume | 110L |
| Cutting process setting steps | ≥30 steps | Cutting breakage rate | ≤1%(excluding human, silicon,wire, maintain factors) |
| Ironic wire tension | 0~110N | Equipment overall power | 50kw |
| Ironic wire speed | 0~30m/S | Equipment weight | 5.5t |
| Diamond wire diameter | ≥0.18mm | Equipment size | 2480×2250×2160mm |
Equipment Advantages
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1、High Cutting Efficiency: The machine can achieve a stable cuttingspeed of 30m/s, offering high cutting efficiency and a high output ratio. 2、Multiple Processing Modes: Supports rotating and materialoscillating processing modes, better meeting diverse processrequirements. 3、Precision Processing: High processing accuracy with the TTV (TotalThickness Variation) of the cut sample < 30um, significantly exceeding industry standards. 4、Stable Cutting: Capable of stable operation with 0.18mm diamondwire, precise tension control, and excellent material loss management. 5、High Precision Control: Equipped with a controller from INOVANCETechnology and 13 high-precision servo motors to ensure precise operation. 6、Vibration Control: The wire winding system is arranged on bothsides of the machine, effectively reducing vibrations and greatly improving processing precision. |
Processing 12-inch silicon carbide wafers on a diamond wire saw. |
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Dalian Factory: No. 30, Huantai West Street, Yingchengzi Industrial Park, Ganjingzi District, Dalian City