CNC Crystal Roll Grinding Machine
Technical Specifications
Key Technical Specifications
| Processing materials | Silicon | Silicon carbide |
| Diameter of the workpiece | φ100-150mm | φ150-310mm |
| Maximum length of the workpiece | 400mm | 300mm |
| Roundness | ±0.02mm | ±0.01mm |
| Taper | ±0.03mm | ±0.015mm |
| Diameter accuracy | ±0.02mm | ±0.02mm |
| Surface roughness | Ra≤1.2µm | Ra≤1.2µm |
| OF width end-to-end deviation | ±0.3mm | ±0.1mm |
| Crystal orientation accuracy | ±10' | ±10' |
| V-Notch Depth/Angle | 1–1.25 mm / 89°–94° | 1–1.25 mm / 89°–94° |
| Total equipment power | 20kW | 20kW |
| Equipment weight | 4.5t | 4.5t |
| Equipment external dimensions | 3620x1800x2000mm | 3800x1600x2150mm |
Equipment Advantages
1. The machine bed, worktable, and headstock/tailstock housings are all integrally cast, ensuring structural stability.
2. The equipment is equipped with Mitsubishi PLCs and servo drives, ensuring stable long-term operation and high machining accuracy.
3. The headstock, tailstock, and grinding wheel headstock bearing housing are independently developed and assembled in-house, with precision exceeding industry standards.
4. The fixture employs a combination of fixed and universal adjustable centers, ensuring secure and reliable workpiece clamping and maintaining grinding accuracy even under substantial material removal rates and grinding forces.
5. The equipment features three major functions: external cylindrical grinding, OF‑surface grinding, and notch‑groove milling, with automatic workpiece clamping that is stable and reliable.
Silicon |
LT/LN |
Silicon carbide |
Gallium arsenide/indium phosphide |
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