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Diamond Wire CuttingMachine

LQJD60150

Category：

Silicon Component Equipment

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Keywords：Diamond Wire CuttingMachine

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0510-68106702

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Technical Specifications

Main Technical Specifications

Diameter of the workpiece	φ350–φ600mm	Cutting flatness	0.5m
Length of the workpiece	200–2500 mm (expandable to 3500 mm)	Operating line speed	≤1800m/min
Sample thickness	1.5~3mm	Total equipment power	7kW
Surface roughness of the machined part	Ra<10μm	Equipment weight	6t
Diamond wire diameter	0.5mm	Equipment external dimensions	3800x1900x3150mm
Diameter of the workpiece	φ350–φ600mm	Cutting flatness	0.5m

Equipment Advantages

1. Flexible switching between different silicon rod specifications, accommodating the cutting of round rods with diameters ranging from 350 to 600 mm.

2. Large loading capacity: the maximum cutting length for silicon ingots is 2,500 mm, expandable up to 3,500 mm.

3. The silicon ingot is supported using a bonding material, which helps minimize chipping at the cut edges.

4. It can stably cut at a maximum linear speed of 40 m/s, ensuring cutting quality.

5. The annular cutting produces a high-quality surface finish;

6. The drive pulley, tension pulley, and idler pulley are all equipped with pneumatic lubrication, which ensures both internal sealing and adequate lubrication, thereby significantly extending the service life of the bearings.

7. The bed is a welded structure that undergoes stress-relief annealing after welding, ensuring excellent rigidity and stable, reliable performance.

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