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Full-automatic DiamondWire Cutting Machine

LQJD33250P

Category：

Silicon Equipment

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Keywords：Full-automatic DiamondWire Cutting Machine

Product Inquiry

0510-68106702

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Technical Specifications

Key Technical Specifications

Diameter of the workpiece	8 inches / 12 inches	Cutting flatness	0.2mm
Length of the workpiece	150~2500mm	Operating line speed	≤2400m/min
Sample thickness	1.3-2.5mm	Total equipment power	23.5kW
Surface roughness of the machined part	Ra<3μm	Equipment weight	9t
Diamond wire diameter	0.5mm	Equipment external dimensions	5900x3900x3600mm

Equipment Advantages

1. The loading cart (optional AGV) is pushed to the gantry robot’s loading station, where the work order is scanned; the robot then conveys the silicon ingot to the loading table of the cutting machine.

2. Based on the preset cutting position, the loading conveyor moves the silicon ingot to the machining station for processing.

3. A double-rail gantry-type cutting head is used for end‑trimming and for cutting to varying segment lengths.

4. The BLOCK is automatically conveyed to the unloading station, where it undergoes weighing and laser marking; subsequently, the unloading gantry robot picks it up and places it onto the unloading cart, which then performs automatic weighing.

5. The equipment is configured with a robot equipped with suction cups to automatically pick up sample wafers; after the wafers are dried by blowing, they undergo laser marking and are then transferred into the wafer receiving tray.

6. Repeat the truncation and sample‑slice operations described in steps 2–5 above.