• Full-automatic Diamond WireSample Cutting Machine
Full-automatic Diamond WireSample Cutting Machine
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Full-automatic Diamond WireSample Cutting Machine

LQJD338OPX

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Keywords:Full-automatic Diamond WireSample Cutting Machine


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Technical Specifications

Main Technical Specifications

Diameter of the workpieceφ300-φ350mmCutting flatness0.2mm
Length of the workpiece≤450mmOperating line speed≤50 m/s
Sample thickness1.3~2.5mmTotal equipment power11kw
Surface roughness of the machined partRa<3μmEquipment weight4t
Diamond wire diameter0.5mmEquipment external dimensions3600×2260×2480mm

 

Equipment Advantages

Automatic feeding of silicon ingotsScan the work order, enter the quantity and thickness of the automatically retrieved wafers, and the gantry robot will convey the silicon ingots to the cutting machine’s loading platform.
Automatic end-face measurementAutomatic measurement of end-face perpendicularity deviation in silicon ingots, with precise calculation of the cutting edge position.
Automatically crop imagesThe suction‑cup bucket is conveyed by a robotic arm to the end face of the silicon ingot; the suction cup then grips the ingot, and the equipment proceeds with the slicing operation.
Automatic blow-drying, laser markingAfter the cut samples are dried by blowing, a robotic arm transports them to the laser marking station for coding.
Sample stackingThe robotic arm conveys the samples to the sample holder in sequence.
Repeating slicing of the ingot headBased on the configured machining parameters, automatically perform slicing by repeating steps 3–4–5–6.
Automatic rotation of silicon rodsAfter the gantry robot arm rotates the ingot by 180 degrees, it performs end-face measurement and calibration.
Repeating slicing of the ingot’s tail endBased on the configured machining parameters, automatically perform slicing by repeating steps 3–4–5–6.
Automatic silicon ingot unloadingThe material rack moves to the unloading position, and the gantry robot transfers the silicon ingot to the loading/unloading cart.

 

 

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