Full-automatic Diamond WireSample Cutting Machine
LQJD338OPX
产品亮点
Technical Specifications
Main Technical Specifications
| Diameter of the workpiece | φ300-φ350mm | Cutting flatness | 0.2mm |
| Length of the workpiece | ≤450mm | Operating line speed | ≤50 m/s |
| Sample thickness | 1.3~2.5mm | Total equipment power | 11kw |
| Surface roughness of the machined part | Ra<3μm | Equipment weight | 4t |
| Diamond wire diameter | 0.5mm | Equipment external dimensions | 3600×2260×2480mm |
Equipment Advantages
| Automatic feeding of silicon ingots | Scan the work order, enter the quantity and thickness of the automatically retrieved wafers, and the gantry robot will convey the silicon ingots to the cutting machine’s loading platform. |
| Automatic end-face measurement | Automatic measurement of end-face perpendicularity deviation in silicon ingots, with precise calculation of the cutting edge position. |
| Automatically crop images | The suction‑cup bucket is conveyed by a robotic arm to the end face of the silicon ingot; the suction cup then grips the ingot, and the equipment proceeds with the slicing operation. |
| Automatic blow-drying, laser marking | After the cut samples are dried by blowing, a robotic arm transports them to the laser marking station for coding. |
| Sample stacking | The robotic arm conveys the samples to the sample holder in sequence. |
| Repeating slicing of the ingot head | Based on the configured machining parameters, automatically perform slicing by repeating steps 3–4–5–6. |
| Automatic rotation of silicon rods | After the gantry robot arm rotates the ingot by 180 degrees, it performs end-face measurement and calibration. |
| Repeating slicing of the ingot’s tail end | Based on the configured machining parameters, automatically perform slicing by repeating steps 3–4–5–6. |
| Automatic silicon ingot unloading | The material rack moves to the unloading position, and the gantry robot transfers the silicon ingot to the loading/unloading cart. |

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